FAB & ASSEMBLY

Cenomatrix provides the following turnkey services:

• RoHS/WEEE compliant
• OSP finish
• IPC compliant
• Blind, Buried and micro vias
• Up to 30+ layers
• Board thickness from 15 mils to 200+ mils
• Panel size up to 31" X 52"
• Aspect ratio 12:1
• High speed materials and composites
• Minimum dielectric thickness 2 mils
• 3 mil line and 3 mil spacing
• Impedance control +/- 5 %
• Via in pad and plugged vias
• Design for manufacturability (DFx) and cost optimization
• BOM analysis, component engineering
• Signal integrity modeling
• EMC/EMI consulting
• PCB fabrication, assembly and test
• Backplane fabrication, assembly and test
• Cable assembly
• Enclosure fabrication
• Validation and regulatory compliance
• Reliability test and analysis
• Final system integration and test