High-speed PCB layout from multilayer designs to high-density boards
High-density interconnect (HDI), RF boards, DDR4, DDR5,
PCIe Gen5. Designing for Silicon Valley and the East Coast
for over 20 years.
PCB Layout
High-speed, high-density and HDI boards in Cadence Allegro, from fine-pitch BGA fanout to DDR and PCIe. Fab-ready Gerbers or ODB++ with a DFM-checked stackup drawing.
PCB Layout ServicesFabrication & Assembly
Turnkey prototypes and production through qualified partners, managed by the engineer who laid out your board. Up to 30+ layers, impedance control to ±5%.
Fab & Assembly ServicesHardware Design
Concept to prototype when you need the whole board: specifications, component selection, schematic capture, FPGA and firmware, analog, power and RF.
Hardware Design Services
Design Expertise
- Analog, digital, RF/microwave, mixed-signal and high-speed
- HDI design for fine-pitch BGA circuitry
- High-speed design to 112G PAM4 SerDes (106 Gb/s per lane)
- Signal-integrity and crosstalk analysis
- Impedance control for optimal stackup
- Designs built on USB, HDMI, PCIe, NVMe, SerDes, DDR4, DDR5 interfaces
- Choice of materials for high-speed PCB layout: Megtron 6, Rogers RO4350B, Tachyon 100G
Let's work together
Send your schematic, BOM and board outline to get started.